Cart
Your cart is empty, but doesn't have to be..
Retronix offers a unique range of services that help to improve production processes and save on production costs.
Retronix uses laser technology for BGA balling, which is a safe and cost-effective method for components. No part of the process contains reflow temperatures and as the only manufacturer in the world, Retronix's processes meet the strict manufacturing specifications of IC circuit manufacturers. The laser beam is directed to each bump separately, so it does not cause the circuit to heat up -> no reflow cycle!
Retronix offers a unique range of services that help to improve production processes and save on production costs.
Retronix has developed a unique method to salvage valuable components from circuit boards. In this method, the components are not exposed to reflow temperatures and the process meets the manufacturing specifications of the component manufacturers. The method can be used to recycle e.g. valuable prototype components for reuse.
Retronix also offers a coating service for components. This is very important if the components have to be stored for years to secure the warranty and repairability of the products. We can also convert leaded components to lead-free and vice versa if, for example, a component needs to be soldered with lead, but the availability is only lead-free.
Your cart is empty, but doesn't have to be..