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Replace Kapton tapes with IQ-BOND 2612-T-FC for reliable thermal profiling
For thermal profiling of PCBs using tools like SolderStar or other profilers, IQ-BOND 2612-T-FC offers a modern alternative to traditional Kapton tapes. This advanced thermally conductive adhesive ensures secure, precise, and repeatable bonding of thermocouples to solder joints or heat sinks during profiling.
Its chemistry has been selected to resist multiple consecutive solder reflows, with a peak temperature of up to 260°C. For applications where the temperature is exposed for long periods at elevated temperatures, the chemistry can withstand 125 °C —150°C.
For cleaning uncured IQ-BOND 2612-T-FC, IQ-CLEANER 9500 is recommended, although other organic cleaning solvents, such as IPA and/or acetone, can also be considered.
Upgrade your thermal profiling workflow today with IQ-BOND 2612-T-FC— achieve accuracy and durability, tape-free.
For thermal profiling of PCBs using tools like SolderStar or other profilers, IQ-BOND 2612-T-FC offers a modern alternative to traditional Kapton tapes. This advanced thermally conductive adhesive ensures secure, precise, and repeatable bonding of thermocouples to solder joints or heat sinks during profiling.
Key Benefits of IQ-BOND 2612-T-FC:
- Fast curing: Achieves strong mechanical bonds at room temperature in just 4–6 minutes, with even faster curing at elevated temperatures.
- Easy application: Two-component epoxy with a simple 1:1 mix ratio and high viscosity to prevent flow during application.
- Reliable thermal conductivity: Optimised for heat dissipation, it is ideal for bonding thermocouples and heat spreaders.
- Durable: It can withstand repeated solder reflows up to 260°C and extended exposure to elevated temperatures (125°C–150°C).
- Broad compatibility: Bonds well to metals, PCBs, glass, ceramics, and plastics, ensuring versatility for various profiling and assembly tasks.
Its chemistry has been selected to resist multiple consecutive solder reflows, with a peak temperature of up to 260°C. For applications where the temperature is exposed for long periods at elevated temperatures, the chemistry can withstand 125 °C —150°C.
Why Choose IQ-BOND 2612-T-FC?
This fast-curing adhesive simplifies the profiling process, eliminating the inconsistency and hassle of tape applications. Whether securing thermocouples for precise thermal measurements or bonding heat sinks for effective heat management, IQ-BOND 2612-T-FC delivers professional results with minimal effort.For cleaning uncured IQ-BOND 2612-T-FC, IQ-CLEANER 9500 is recommended, although other organic cleaning solvents, such as IPA and/or acetone, can also be considered.
Upgrade your thermal profiling workflow today with IQ-BOND 2612-T-FC— achieve accuracy and durability, tape-free.
| Parameter | Data |
|---|---|
| Name | IQ-BOND 2612-T-FC |
| Product group | Thermally Conductive |
| Strong points | Fast cure, thermo-couple bonding, faster version of IQ-BOND 2611-T-FC |
| One component or two components | 2 K (1:1 wght%) |
| Colour | White |
| Viscosity | Medium |
| Cure | Fast @ Low temperature |
| Thermal conductivity | 1,3 |
| Storage | 12 months @ RT |
| Store @ -15 C to avoid separation of filler | |
| Thyxotropie | Medium |